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Pressing process of circuit board with LAUFFER press

Published:

2022-11-23 16:01

Pressing process of circuit board of LAUFFER laminator

1. Concept: multiple core boards with good circuit graphics are bonded together under the condition of high temperature and high pressure through the semi curing sheet

2. The pressing mainly involves materials

1) Copper Clad Laminate with Finished Graphics

  2)PP

3) Copper foil

3. Process

1) The purpose of browning: clean the board surface and roughen the copper surface to increase the adhesion

2) The purpose of pre stacking is to pre stack multiple copper clad laminates and PPs that complete the figure together according to the hierarchy

3) The purpose of hot melting: pre fuse the laminated plates together at high temperature (plate edge fusion) to reduce the offset between layers

4) Purpose of pre arrangement: juxtapose several pre fusion plates and copper foils on the tray of the press

5) The purpose of pressing: to fully integrate the patterned copper clad laminate and PP through high temperature and high pressure

6) X-RAY drilling target: drill the inner layer graphic positioning hole by laser irradiation, which is convenient for CNC drilling positioning

4. Advantages

1) Up to 32L boards can be produced

2) CCD hot-melt machine: the minimum inter layer alignment accuracy is 2mil

3) Layout line: fully automatic cutting of copper foil, the thinnest copper foil can produce one-third oz

4) Press: It has very high flatness, high temperature uniformity, and the maximum temperature can reach 280 ℃

5) X-ray: shooting accuracy 2mil

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