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Cleaning standards for printed circuit boards

Published:

2022-11-23 15:37

The true cleanliness depends on the product and the desired end use environment. But how do you decide what cleaning is sufficient for a particular end use environment? Through thorough and strict analysis, study each potential pollutant and final use situation, and conduct long-term reliability test.

The following are some IPC standards for PCB cleanliness:

IPC-6012 The light plate before the solder mask coating of all kinds of ions<1.56 μ G/cm2 NaCl equivalent

IPC-6012 Organic * No pollutants are emitted from the smooth plate before the solder mask coating of all types of electronics

J-STD-001 The light plate before the solder mask coating of all types and types of electronics is sufficient to ensure the solderability

J-STD-001 No looseness, no volatilization and minimum electrical interval for all electronic types of particles after welding

J-STD-001 Post weld assembly of rosin * Class 1 electronics<200 μ g/cm2 

Post weld assembly of Class 2 electronics<100 μ g/cm2 

Post weld assembly of Class 3 electronics<40 μ g/cm2 

J-STD-001 Ion * Post weld assembly of all electronic categories<1.56 μ G/cm2 NaCl equivalent

IPC-A-160 Visual acceptability of post weld assemblies for all electronic categories of visible residues

Less than 0.39 for low solid flux μ g/cm2 

For high solid rosin flux, less than 0.70 μ g/cm2 

Less than 0.75 - 0.78 for water-soluble flux μ g/cm2 

Less than 0.31 for tin/lead metallized smooth plate μ g/cm2

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