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Development Requirements of Laminating Process

Published:

2022-11-23 15:13

 

With the continuous development of electronic communication industry, PCB will develop towards multi-layer, thin, high line density, small impedance tolerance, etc. Therefore, higher requirements are put forward for the laminate process:
   

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1. The dimensional stability of the base material and HIGH Tg sheet promote the improvement of the pressing process, and also put forward higher requirements for the press.

2. Put forward higher operating temperature requirements in combination with the pressing conditions of high Tg materials.

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3. Strict impedance requirements narrow the tolerance range of DIELETRIC THICKNESS and require more perfect process conditions for pressing plate.

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4. How to solve the Mis registration problem of multiple circuit boards.

The current production mode is MASS LAMINATION, with high output and simple operation. It can be used for 4-layer boards, 6-layer boards and simple 8-layer boards. But how to solve the alignment problem for more layers of circuit boards?

    

The traditional PIN-LAMINATION uses pin holes to connect the layers, but it brings great inconvenience to the arrangement and removal of LAY-UP plates, and affects the production efficiency and output How to formulate a new processing method, which not only solves the problem of alignment, but also is easy to operate, and is conducive to the increase of output is the current and future problem.

More technical information: http://www.szvstar.cn

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