Xingsen Technology plans to invest 20 million yuan in Huajin Semiconductor
On the evening of April 28, Xingsen Technology (002436) announced that on April 28, the company and all shareholders of Huajin Semiconductor Packaging Pilot Technology Research Center Co., Ltd. Microelectronics Research Institute of the Chinese Academy of Sciences, Changdian Technology, Tongfu Microelectronics, Huatian Technology, Shennan Circuit Co., Ltd., Jingfang Technology Agility Electronic Technology (Suzhou) Co., Ltd. and Jiangsu Zhongke Internet of Things Technology Venture Capital Co., Ltd. signed the Capital Increase Agreement for "Huajin Semiconductor Packaging Pilot Technology Research and Development Center Co., Ltd.". The company plans to invest 20 million yuan in currency with its own funds, holding 16 million shares, accounting for 9.94%.
Before the above investment, Huajin Semiconductor Packaging Pilot Technology Research and Development Center Co., Ltd. had a registered capital of 100 million yuan, and its business scope was technology research and development of integrated circuit packaging and system integration; Technology transfer and technical services of semiconductor integrated circuits and system integrated products; Technology transfer and technology services; Investing abroad with its own assets; Training services (excluding certificate issuing and vocational certificate training uniformly recognized by the state); Self operated import and export business of various commodities and technologies.
Xingsen Technology said that becoming one of the major shareholders of Huajin Semiconductor marks that the company's accumulation of packaging carrier technology has made our company recognized as one of the domestic leading enterprises in this field in the industry. Investing in Huajin Semiconductor will enable the company to have a deep understanding of the development direction of the downstream semiconductor packaging industry, including the technological upgrading of the whole industry chain, such as design, process, equipment and materials, so as to help our company grasp the latest technology in the semiconductor packaging industry.
The direct customers of the company's packaging carrier are downstream packaging and testing companies and vertically integrated semiconductor companies; The major shareholders of Huajin Semiconductor are the leading packaging and testing enterprises in China, such as Changdian Technology, Huatian Technology, and Tongfu Microelectronics. By investing in Huajin Semiconductor, it can provide a good interaction platform between the company and the leading packaging and testing enterprises in China. Through cooperation in technology research and development and market expansion, it can greatly accelerate the process of the company's large-scale packaging and carrier business, which meets the requirements of the company's strategic development.