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Product Description
As the manufacturing process of semiconductor becomes more and more refined, wafers become thinner and thinner, and wafer level packaging faces more and more quality challenges. The patented IR blanking detector can penetrate silicon wafers to help customers confirm whether there are back chippings, hidden cracks and hidden collapses in the IC, and can be equipped with a fully automatic feeding and unloading system and automatic judgment software for effective quality control.
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