Full automatic press plate arrangement production line
In the deposition process of PCB process flow, automatic lay up is performed for SUSPlate+CU (Part 1)+Preparation Lay up and Product (PPG+Product+PPG)+SUS, and deposition is performed on the Carrierplate. In the subsequent process, logistics equipment can be formed from the automatic logistics system to the HotPress process. Product specification:
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Product Description
In the deposition process of PCB process flow, automatic lay up of SUS Plate+CU (Part 1)+preparation lay up and product (PPG+product+PPG)+SUS is performed, and deposition is performed on the Carrier plate. In the subsequent process, logistics equipment can be formed from the automatic logistics system to the Hot Press process.
Product Specification:
Full automatic press plate arrangement production line
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