+
  • image/c27f50eb-bbb5-4a68-a53d-c1a090a5df66.jpg

Full automatic press plate arrangement production line

In the deposition process of PCB process flow, automatic lay up is performed for SUSPlate+CU (Part 1)+Preparation Lay up and Product (PPG+Product+PPG)+SUS, and deposition is performed on the Carrierplate. In the subsequent process, logistics equipment can be formed from the automatic logistics system to the HotPress process. Product specification:


Message

Product Description

In the deposition process of PCB process flow, automatic lay up of SUS Plate+CU (Part 1)+preparation lay up and product (PPG+product+PPG)+SUS is performed, and deposition is performed on the Carrier plate. In the subsequent process, logistics equipment can be formed from the automatic logistics system to the Hot Press process.

Product Specification:

全自动压板排板生产线

key word:

Full automatic press plate arrangement production line

Related products

Message