IC Carrier Plate Laminating Machine
The frame body of IC carrier plate laminating machine adopts the pressure bearing design of tear proof structure and the use of German high-strength steel plate, so that the press will not be deformed when operating at 400 ℃
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Germany LAUFFER is a new model tailored for IC carrier industry: IC carrier laminator; This new press frame body uses the pressure bearing design of tear proof structure and German high-strength steel plate, so that the press will not deform when operating at 400 ℃. Moreover, Germany's fine grinding process ensures that the flatness and parallelism can reach ± 0.015mm/m high accuracy. The high-density gun hole roller design of the heating plate enables the temperature accuracy to be controlled within ± 1.5 ℃ (the 400 ℃ laminating system can be controlled within ± 2 ℃). Its main feature is that it can press products of different heights and sizes, and the pressing area can be expanded to different degrees. The system has a digital interface, from customer specific integration to MES system, tool management and monitoring and traceability of all tools, such as tools, tablets, batch numbers and operator IDs in the laminating process.
LAUFFER laminator, with its experienced team, leading technology and advanced process, is able to provide innovative and complete IC packaging carrier plate laminating solutions. At the same time, it ensures the cost-effectiveness of the most challenging and complex IC packaging carrier plate lamination. LAUFFER laminating system can provide you with leading technology, the highest production efficiency, the best availability and the durability represented by "Made in Germany".
IC Carrier Plate Laminating Machine
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